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ECSIPC

ECSIPC Introduces H610H7-IM1,ADLN-13,ADLN-I Motherboards

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ECS Industrial Computer Co., Ltd., also known as ECSIPC, introduces its new motherboards H610H7-IM1, ADLN-I3, and ADLN-I for various industry applications.

H610H7-IM1, features dual PCI-E x16 expansion slots. In addition, the new ADLN-I3 motherboard offers an extensive array of I/O, including 10 COM ports specifically designed for a wide range of industrial applications. Furthermore, the Mini-ITX SoC motherboard, ADLN-I, offers abundant connectivity options and remarkable flexibility.

  • H610H7-IM1

The H610H7-IM1 motherboard focuses on vertical application industries, with a design featuring dual PCI-E x16 expansion slots. It is particularly suitable for smart transportation, such as automated safety detection.

The motherboard supports the 12th and 13th generation Intel® Core™ processor families, as well as Pentium® and Celeron® processors, delivering the powerful performance. The motherboard also supports DDR4-3200 long DIMM memory, with a maximum capacity of up to 64GB. No matter what computing demands in any industrial application, it can easily handle and run smoothly.

The motherboard’s triple display outputs (DisplayPort, HDMI,VGA) are perfect for digital signage and multi-display requirements. With built-in dual Gigabit and 2.5 Gigabit Ethernet, it brings you high-speed connectivity. The motherboard offers rich features for various industrial applications, boasting 10 COM ports to perfectly meet a variety of industrial automation control needs.

  • ADLN-I3

The ADLN-I3 motherboard is designed with a focus on vertical application industries. Its 10 COM design is particularly well-suited for industrial IoT environments and monitoring and detection applications, such as environmental temperature monitoring, water temperature and quality monitoring, factory equipment data collection, and multi-sensor applications. The monitoring system aids in preventing abnormal situations, ensuring the stable operation, while reducing costs and alleviating manpower needs.

Supporting Intel® Alder Lake-N processors with a maximum TDP of 15W, it brings an unparalleled computing experience. The motherboard supports DDR4-3200 SO-DIMM memory with a capacity of up to 16GB, enabling smoother handling of multiple tasks.

The convenient triple display output support (DisplayPort, HDMI, VGA) is particularly suitable for digital signage and multi-display environments. What’s even more special is that this motherboard comes with a built-in integrated LVDS interface, providing additional display options. Moreover, the dual Gigabit LAN with speeds of up to two gigabits per second ensures faster and smoother data transmission for network connections.

The motherboard features M.2 multiple expansion interfaces, including 1 M.2 M Key and 1 M.2 E Key, provide expansion possibilities for your system. With 10 COM interfaces designed specifically for various industrial applications, it caters to industrial automation control needs to the fullest. The integrated parallel port (LPT) header further extends your functional requirements, bringing greater convenience for connecting and utilizing peripheral devices.

  • ADLN-I

The ADLN-I motherboard is designed with a focus on vertical application industries. Its triple display support (DisplayPort, HDMI, VGA) is particularly suited for digital signage and various smart retail solutions, such as station information display, department store advertising broadcasts, and digital signage in major medical institutions.

The compact motherboard supports Intel® Alder Lake-N processors with an energy-efficient design, featuring a TDP of 10W. Combined with its rich I/O support, it’s an ideal choice for cost-effective and space-saving solutions. The motherboard not only supports DDR4-3200 SO-DIMM memory with a capacity of up to 16GB, but also features extensive I/O interfaces and functions, catering to industry expansion needs and the functionalities required for external peripherals.

In terms of power supply options, the motherboard supports both ATX and DC_IN dual power supply modes (select one for shipping), offering greater flexibility and stability in choosing power sources for different industrial application needs. Regardless of the industry scenario, this motherboard is designed to meet your requirements.

The motherboard’s unique design includes 2 COM interfaces, tailor-made for various industrial applications, ensuring effortless handling of tasks like automation control. The integrated parallel port (LPT) header takes it a step further, expanding functionality requirements and opening up possibilities for a wider range of applications.

ECSIPC Unmasks LIVA Q3 Series Mini PCs

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ECS Industrial Computer Co., Ltd., also known as ECSIPC introduces its latest generation of mini-PCs, the LIVA Q3D and Q3H series. The Q3 Series are also suitable for smart offices, educational settings, digital signage, and various retail solutions, including traffic information displays, mall advertising, and digital signage for medical fields.

The LIVA Q3D and Q3H feature built-in Intel® Pentium®/Celeron® processors that offer 32GB/64GB/128G eMMC storage and micro-SD expansion up to 128GB. With wireless transmission systems of 802.11ac, these mini-PCs also support Intel® UHD Graphics for an immersive 4K visual experience. Enhancing stability, the LIVA Q3 series includes a cooling fan system within its pocket-sized device, ensuring smooth operation even in confined spaces. The LIVA Q3D offers both HDMI and DP dual outputs, amplifying work efficiency across various applications. At the same time, the LIVA Q3H boasts HDMI IN and HDMI OUT functionalities, making it an ideal partner for conference scenarios. The LIVA Q3 series suits versatile work environments with its design.

The LIVA Q3D and Q3H are equipped with Windows 11 and multiple connectivity ports, including 2 USB 3.2 Gen1, 1 USB 2.0, 1 HDMI, 1 Gigabit LAN, and 1 micro-SD card slot. The LIVA Q3D features an additional DP, while the LIVA Q3H includes an HDMI IN port, catering to video conference scenarios.

The Q3H caters to multi-display conference needs and offers HDMI IN support with three switch modes: detect HDMI cable plug in, external switch button, and application-based switching. Experience the multi-display conferencing with Q3H, ensuring smoother, efficient meetings and showcasing professionalism.

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ECSIPC to Participate at InfoComm 2023

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ECS Industrial Computer Co., Ltd., (ECSIPC) announce its participation at InfoComm 2023. ECSIPC will be exhibiting its latest LIVA Mini PC series designed for commercial environments and IoT with edge processing applications, and its new motherboard solutions for industrial use, supporting the latest Intel 13th Generation Core Processors.

Join ECSIPC at InfoComm 2023: Stand #1461, Orange County Convention Center, June 14 to 16, 2023.

With an embedded 13th Generation Intel® Core™ i Processor, the new generation of LIVA Z5 Plus and LIVA Z5E Plus mini-PCs provide highly capable performance at minimal power use. These cutting-edge mini-PCs can connect up to four 4K monitors simultaneously. Rich I/O is available, and storage options include a superfast M.2 2280 PCI-E NVMe Gen-4×4 SSD, and option of 2.5-inch SATA SSD (Z5E Plus). Connectivity includes two 2.5GbE, with the option of Intel vPro®, and Wi-Fi 6 connectivity, providing multi-gigabit performance. HDMI with CEC, DisplayPort, and DP over USB Type-C display connections and USB 4 and USB 3 ports are ready for diverse use cases and applications.

The LIVA One H610 and B660 Barebone Mini PCs support 13th Generation Intel® Core™ i processors(65W) with up to 24 CPU cores enabling unparalleled computing performance for wide-ranging business and edge applications. Add up to 64GB, up to four simultaneous displays and connect via the latest Wi-Fi 6 networking, and the LIVA One series is ideal for business use, AI applications, edge computing, intelligent dynamic signage, self-service kiosks, ATM banking systems, terminals, and gateways.

The B760H7-M20 supports 13th Generation Intel® Core™ i Processors and superfast DDR5 memory up to 64GB capacity, plus a PCI-Express 16x Gen 5 primary expansion slot for add-in boards that require extreme performance. Two M.2 slots are available including 2280 for high-performance M-key PCI-Express 4x NVMe SSDs and 2230 for E-key PCI-Express/USB add-in cards, such as Wi-Fi, with support for Intel® CNVi. Eight USB ports are available including USB-C on the rear IO, plus gigabit Ethernet, four SATA III ports with RAID support, and multiple display outputs are built in to take advantage of Intel® Iris® Xe Graphics.

The industrial H610H7-IM1 motherboard supports Intel® 13th Generation Core™ i processors but uses a different layout supporting 2 DIMMS of dual channel DDR4 up to 64GB. Industrial-focused features include 10 COM ports, support for wide temperature operation, product longevity and reliability commitment. Beyond industrial applications, the H610H7-IM1 is suitable for kiosk, POS, panel PC, vending machines, ATM banking terminals, healthcare equipment, and factory automation.

ECSIPC Participates at Computex 2023

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ECS Industrial Computer Co., Ltd.,  announced its participation at Computex 2023. It will introduce a wide range of comprehensive new products for smart retail, automation intelligence, information kiosks, lottery terminals, including the LIVA Z5 Plus mini-PC series, B760H7-M8 and Q670H7-IS1 motherboards. ECSIPC will exhibit its comprehensive smart charging solutions including AC charger for home and commercial use and DC charger with 360kW DC power output, ready for direct deployment in commercial and enterprise applications.

Join ECSIPC in Taipei Nangang Exhibition Center, Taipei, Hall 1, 4F, at Booth number L0317a from May 30th to June 2nd, 2023.

ECSIPC is launching its new LIVA Z5 Plus and LIVE Z5E Plus mini-PCs at Computex 2023. Visitors can order their own bubble tea from a fully automated self-service kiosk that includes multiple 4K displays showing drinks menu, order status, and sales promotions, all from a single LIVA Z5 plus. These cutting-edge mini-PCs can connect up to four 4K monitors simultaneously. With an embedded 13th Generation Intel® CoreTM i Processor, it provides highly capable performance at minimal power use. Rich I/O is available, and storage options include a superfast M.2 2280 PCI-E NVMe Gen-4×4 SSD, and option of 2.5-inch SATA SSD (Z5E plus). Connectivity includes two 2.5GbE, with the option of Intel vPro®, and Wi-Fi 6 connectivity, providing multi-gigabit performance.

Supporting 13th Generation Intel® CoreTM i Processors and superfast DDR5 memory, the motherboard uses 100% solid capacitors for stability and life-cycle longevity. Advanced 3D graphics can be added via GPU card into the PCI-Express 5.0 16x slot, and storage options include two ultra-high speed M.2 NVMe SSD PCI-E 4×4, and four SATA ports.

The ECSIPC Q670H7-IS1 motherboard is ideal for automation intelligence in industrial applications such as Smart Auto Test Equipment, and Autonomous Mobile Robot (AMR). It supports 13th Generation Intel® CoreTM i Processors and a PCI-Express 5.0 16X slot for high-performance GPU or FPGA cards ready for AI/ML processing. This compact mini-ITX motherboard is ideal for small equipment spaces. Capacious DDR5 up to 128GB, superfast M.2 NVMe PCI-E 4×4, and SATA SSD storage is available. Connectivity includes two Ethernet, Wi-Fi/BT and even LTE/5G modules. Legacy COM RS232/422/485 are available to support a wide range of industrial equipment interfaces.

 ECSIPC has launched a Smart DC Charger capable of dual output up to an impressive 360kW (400A max, 480V, 3-phase). It features an integrated digital signage display that allows easy to see status information and even display advertising opportunities for public operators, plus an integrated PCI-PTS Payment System that allows tap-to-pay via secure internet access.

ECSIPC launch Dynamic Signage and IOT Solutions Product Lineup at ISE2023

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ECS Industrial Computer Co., Ltd., (ECSIPC) announced its participation at ISE 2023 at the Fira de Barcelona Gran Vía, stand No.2F740, from January 31 to February 3. ECSIPC will be exhibiting the latest comprehensive LIVA Mini PC series, AiO PC, and motherboard solutions.

The entire LIVA Mini PC family – including the pocket-sized Q, multi-functional Z, and ultra-powerful One series – offer various models perfectly suited for wide-ranging solutions including smart retail, smart transportation, digital signage, video conferencing, intelligent edge computing for AI, cloud computing for gateway, and mini-servers for data centers.

The redesigned ultra-small LIVA Q3D and Q3H feature Intel Jasper Lake processors with Intel Graphics and media acceleration, eMMC up to 128GB, and three USB ports. Equipped with the latest 802.11ac technology to effortlessly support your wireless connection, the LIVA Q3 series also features a function to turn the PC on and off via a TV remote. The LIVA Q3H also supports one HDMI-in and one HDMI-outas the perfect device for video conferencing by connecting with a guest PC and allowing it to easily be added to a meeting.

The new generation of LIVA One H610 and B660 Barebone Mini PCs support Intel 12th generation CPUs up to 65-watt, dual channel memory up to 64GB, video output up to four displays simultaneously, and the latest wireless networking. The LIVA One series is ideal for AI applications, edge computing, intelligent dynamic signage, self-service kiosks, banking ATM systems, terminals, and gateways.

Powered by Intel’s 12th Generation Core i3, i5, i7 processors and featuring expandable memory/storage design, the elegant yet powerful LIVA G24-MH610 AiO provides outstanding performance and large storage capacity to benefit multitasking for home and business.

At 23.8 inches in size and completely self-contained with a full HD 10-point touchscreen on the display, it also features a built-in 2 mega-pixel camera, adjustable tilt, and wide viewing angles. Two 3W speakers, 2x USB 3.2 Gen 1×1, 2x USB 3.2 Gen 2×1, 2x USB 2.0, 1x COM port, and VESA compatibility, make this AiO the perfect choice for interactive teaching, virtual meetings, POS and hotel check-in systems, or retail kiosks.

Build your dream PC with the new LEET flagship Gaming Motherboard Z790H7-A supporting the latest Intel® LGA 1700 CPUs. It supports four DIMMs of dual channel DDR5 up to 128GB, PCIe 5.0 and 4.0 slots, 2.5Gb LAN, and the latest wireless networking for jaw-dropping performance packed into a sleek motherboard that delivers the ultimate gaming/user experience

The industrial H610H7-IM1 motherboard also supports the latest Intel LGA 1700 12th & 13th Gen processors but uses a different layout supporting 2 DIMMS of dual channel DDR4 up to 64GB. Expansion and industrial features such as Rich I/O port,10 com, wide temperature design, longevity, and reliability are suitable for kiosk, POS, panel PC, vending and banking machines, medical equipment, and factory automation.